The Filipino-American League of Engineers and Architects (FALEA) has established the FALEA Scholarship Fund for the purpose of providing scholarship to Hawaii residents who are attending or planning to attend college/university to pursue a degree in Engineering, Architecture, Surveying or related field on a full-time basis.  Successful applicants will receive a monetary grant  and must be claimed and used within the academic year 2012-2013 for which the award is given.  A recipient can again apply for the scholarship grant for the next academic year.

 

The following criteria will be used in making the final selections for the scholarships:

 

1.  Academic Performance

High School and/or College Transcripts are used to determine academic performance.  At least 3.00 GPA. Original transcripts must be submitted. Photocopied transcripts or transcripts downloaded from the internet will not be accepted.

 

2.  Personal Letter

An essay that will provide the applicants the opportunity to express themselves.  The essay must explain why the applicants are seeking scholarship, what extra curricular activities they have been involved, what positions they held in organizations or clubs, community service and other information that they feel might be helpful.

 

3.  Recommendation

A recommendation letter is required (use the attached Recommendation Form).  The recommendation shall be from any FALEA members, past employers, teachers or professors.

 

4.  Personal Photo

A personal photo attached to the application form to be used for publishing  in the souvenir program. (Any picture submitted will be part of the foundation's document and will not be returned.)

 

Please call Ramon Bonoan at 265-4346 for any questions about FALEAs scholarship program and for FALEAs scholarship application. Application materials, including forms, transcripts and recommendations must be postmarked no later than September 21,  2012 to the following:

 

  FALEA Scholarship Program

P. O. Box 4135

Honolulu, HI  96812

CLICK HERE FOR SCHOLARSHIP APPLICATION…